Invention Grant
- Patent Title: Method of manufacturing printed circuit board and method of inspecting printed circuit board
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Application No.: US15057621Application Date: 2016-03-01
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Publication No.: US10067073B2Publication Date: 2018-09-04
- Inventor: Yoshihiro Toyoda
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2015-049788 20150312
- Main IPC: G01N21/956
- IPC: G01N21/956 ; G01N21/88 ; H05K3/10 ; G01N21/89 ; H05K1/02 ; H05K13/08 ; H05K1/05
Abstract:
A base insulating layer and a cover insulating layer of a first printed circuit board are formed of a first insulating material, and a base insulating layer and a cover insulating layer of a second printed circuit board are formed of a second insulating material. During inspection of the first printed circuit board, the first printed circuit board is irradiated with first light having a peak wavelength in a first wavelength range, and an image is produced based on reflected light from the first printed circuit board. During inspection of the second printed circuit board, the second printed circuit board is irradiated with second light having a peak wavelength in a second wavelength region different from the first wavelength region, and an image is produced based on reflected light from the second printed circuit board.
Public/Granted literature
- US20160266050A1 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF INSPECTING PRINTED CIRCUIT BOARD Public/Granted day:2016-09-15
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