Invention Grant
- Patent Title: Testing probe, semiconductor testing fixture and fabrication method thereof
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Application No.: US14927642Application Date: 2015-10-30
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Publication No.: US10067162B2Publication Date: 2018-09-04
- Inventor: Lei Shi
- Applicant: TONGFU MICROELECTRONICS CO., LTD.
- Applicant Address: CN Nantong
- Assignee: TONGFU MICROELECTRONICS CO., LTD.
- Current Assignee: TONGFU MICROELECTRONICS CO., LTD.
- Current Assignee Address: CN Nantong
- Agency: Anova Law Group, PLLC
- Priority: CN201410606866 20141030; CN201410606939 20141030
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R3/00
Abstract:
A testing probe is provided. The testing probe includes a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on a side surface of the insulation layer.
Public/Granted literature
- US20160124018A1 TESTING PROBE, SEMICONDUCTOR TESTING FIXTURE AND FABRICATION METHOD THEREOF Public/Granted day:2016-05-05
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