Invention Grant
- Patent Title: Wiring module equipped with external cover member
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Application No.: US15560515Application Date: 2016-03-16
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Publication No.: US10068682B2Publication Date: 2018-09-04
- Inventor: Yasushi Itani , Tomoya Kawaguchi
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-shi, Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-shi, Osaka
- Agency: Reising Ethington, P.C.
- Priority: JP2015-077553 20150406
- International Application: PCT/JP2016/058317 WO 20160316
- International Announcement: WO2016/163217 WO 20161013
- Main IPC: H02G3/04
- IPC: H02G3/04 ; H01B7/18 ; H01R4/72 ; B60R16/03

Abstract:
A wiring module equipped with an external covering member includes an external covering pipe; a first conductive wire member that is inserted into the external covering pipe, a first end portion of the first conductive wire member extending from a first-end opening portion of the external covering pipe; a second conductive wire member that is connected to the first end portion of the first conductive wire member via a connection portion that is located outward of the first-end opening portion of the external covering pipe; and a bending mitigating member that is capable of undergoing elastic bending deformation more easily than the external covering pipe, a first end portion of the bending mitigating member being fixed to the first-end opening portion of the external covering pipe, and the bending mitigating member extending up to the connection portion or beyond the connection portion while surrounding the first conductive wire member.
Public/Granted literature
- US20180114612A1 WIRING MODULE EQUIPPED WITH EXTERNAL COVER MEMBER Public/Granted day:2018-04-26
Information query
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