A method for manufacturing an electronic component includes preparing a rectangular or substantially rectangular parallelepiped multilayer body made of dielectric ceramic containing Ti and Ba. The multilayer body includes inner electrodes embedded therein, a pair of opposite end surfaces, and four side surfaces connecting the end surfaces to each other. The method further includes forming an oleophobic coating film containing BaF on the surface of the multilayer body, and immersing the end surfaces of the multilayer body having the coating film formed thereon into a conductive paste having a viscosity of about 15 Pa·s or less.