Invention Grant
- Patent Title: Wafer susceptor for forming a semiconductor device and method therefor
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Application No.: US13791007Application Date: 2013-03-08
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Publication No.: US10068791B2Publication Date: 2018-09-04
- Inventor: John Michael Parsey, Jr. , Hocine-Bouzid Ziad
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Robert F. Hightower
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/687
Abstract:
In one embodiment, a wafer susceptor is formed to have portion of the susceptor that is positioned between a wafer pocket and an outside edge of the susceptor to have a non-uniform and/or a non-planar surface. In another embodiment, the non-uniform and/or non-planar surface includes one of a recess into the surface or a protrusion extending away from the surface.
Public/Granted literature
- US20140251542A1 WAFER SUSCEPTOR FOR FORMING A SEMICONDUCTOR DEVICE AND METHOD THEREFOR Public/Granted day:2014-09-11
Information query
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