Invention Grant
- Patent Title: Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
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Application No.: US15722547Application Date: 2017-10-02
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Publication No.: US10068812B2Publication Date: 2018-09-04
- Inventor: Taryn J. Davis , Jonathan R. Fry , Tuhin Sinha
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Steven Meyers
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; G01R31/28 ; H01L21/54 ; H01L21/48 ; H01L23/522
Abstract:
Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.
Public/Granted literature
- US20180019172A1 METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING USING CAPACITIVE SENSORS GROUPS Public/Granted day:2018-01-18
Information query
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