Invention Grant
- Patent Title: Apparatus and methods for multi-die packaging
-
Application No.: US15630633Application Date: 2017-06-22
-
Publication No.: US10068841B2Publication Date: 2018-09-04
- Inventor: Zhiwei Gong , Wei Gao
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L21/48 ; H01L23/00 ; H01L25/16 ; H05K1/11 ; H05K3/34 ; H05K1/18
Abstract:
A semiconductor device assembly includes an interposer having an opening extending from a first major surface to a second major surface of the interposer and a plurality of external connectors on the second major surface. The first major surface of the interposer is attached to a packaged semiconductor device. The opening of the interposer exposes the packaged semiconductor device.
Public/Granted literature
- US20170317020A1 APPARTUS AND METHODS FOR MULTI-DIE PACKAGING Public/Granted day:2017-11-02
Information query
IPC分类:
