Invention Grant
- Patent Title: Surface nitridation in metal interconnects
-
Application No.: US15444933Application Date: 2017-02-28
-
Publication No.: US10068846B2Publication Date: 2018-09-04
- Inventor: Lawrence A. Clevenger , Roger A. Quon , Terry A. Spooner , Wei Wang , Chih-Chao Yang
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L21/768 ; H01L21/311

Abstract:
Conductive contacts include a first conductor disposed within a first dielectric layer, the first conductor having a recessed area in least one surface. A second dielectric layer is formed over the first dielectric layer, comprising a trench positioned over the first conductor. A second conductor is formed in the trench and the recessed area to form a conductive contact with the first conductor.
Public/Granted literature
- US20180082945A1 SURFACE NITRIDATION IN METAL INTERCONNECTS Public/Granted day:2018-03-22
Information query
IPC分类: