- Patent Title: Semiconductor package device and method of manufacturing the same
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Application No.: US15333008Application Date: 2016-10-24
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Publication No.: US10068854B2Publication Date: 2018-09-04
- Inventor: Wei-Hsuan Lee , Jaw-Ming Ding , Wei-Yu Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/522 ; H01L23/60 ; H01L27/32 ; H01L23/552 ; H01L23/498 ; H01L23/00 ; H01L21/48 ; H01L21/56
Abstract:
A semiconductor package device includes a substrate, a passive component, an active component and a package body. The passive component is disposed on the substrate. The active component is disposed on the substrate. The package body is disposed on the substrate. The package body includes a first portion covering the active component and the passive component, and a second portion covering the passive component. A top surface of the second portion of the package body is higher than a top surface of the first portion of the package body.
Public/Granted literature
- US20180114757A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-04-26
Information query
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