A method includes providing a die including a substrate and a bonding pad over the substrate, forming a connective layer over the die, and forming the landing pad over the connective layer. The forming the connective layer includes depositing a dielectric layer of a dielectric material over the die and patterning the dielectric layer. The patterning the dielectric layer includes forming a supporting pad area and forming a conductive channel area. A portion of the conductive channel area passes at least partially through the supporting pad area. At least one dielectric region interpose the portion of the conductive channel area and the supporting pad area. The forming the connective further includes filling the supporting pad area and the conductive channel area with a conductive material. The supporting pad area of the conductive material forms a supporting pad. The conductive channel area of the conductive material forms a conductive channel.