Invention Grant
- Patent Title: Integrated circuit structure incorporating non-planar field effect transistors with different channel region heights and method
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Application No.: US15715220Application Date: 2017-09-26
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Publication No.: US10068902B1Publication Date: 2018-09-04
- Inventor: Yanping Shen , Hui Zang , Hsien-Ching Lo , Yongjun Shi , Randy W. Mann , Yi Qi , Guowei Xu , Wei Hong , Jerome Ciavatti , Jae Gon Lee
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Gibb & Riley, LLC
- Agent Francois Pagette
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L27/11 ; H01L29/06 ; H01L29/66

Abstract:
Disclosed is a method of forming an integrated circuit (IC) structure with multiple non-planar transistors having different effective channel widths. In the method, sacrificial gates are removed from partially completed transistors, creating gate openings that expose sections of semiconductor fins between source/drain regions. Prior to forming replacement metal gates in the gate openings, additional process steps are performed so that, in the resulting IC structure, some transistors have different channel region heights and, thereby different effective channel widths, than others. These steps can include forming isolation regions in the bottoms of some gate openings. Additionally or alternatively, these steps can include filling some gate openings with a sacrificial material, recessing the sacrificial material to expose fin tops within those gate openings, either recessing the fin tops or forming isolation regions in the fin tops, and removing the sacrificial material. Also disclosed is an IC structure formed according to the method.
Information query
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