Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15441850Application Date: 2017-02-24
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Publication No.: US10068964B2Publication Date: 2018-09-04
- Inventor: Yuki Nakano , Ryota Nakamura
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2011-020730 20110202; JP2011-101786 20110428
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/16 ; H01L29/04 ; H01L29/10 ; H01L29/78 ; H01L21/04

Abstract:
A semiconductor device includes a semiconductor layer made of a wide bandgap semiconductor and including a gate trench; a gate insulating film formed on the gate trench; and a gate electrode embedded in the gate trench to be opposed to the semiconductor layer through the gate insulating film. The semiconductor layer includes a first conductivity type source region; a second conductivity type body region; a first conductivity type drift region; a second conductivity type first breakdown voltage holding region; a source trench passing through the first conductivity type source region and the second conductivity type body region from the front surface and reaching a drain region; and a second conductivity type second breakdown voltage region selectively formed on an edge portion of the source trench where the sidewall and the bottom wall thereof intersect with each other in a parallel region of the source trench.
Public/Granted literature
- US20170170259A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-06-15
Information query
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