Invention Grant
- Patent Title: Light emitting device having wire including stack structure
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Application No.: US14499421Application Date: 2014-09-29
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Publication No.: US10069053B2Publication Date: 2018-09-04
- Inventor: Shinya Okura , Shintaro Nakashima , Hiroki Fukuta
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2013-203440 20130930
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L33/62 ; H01L33/58 ; H01L33/50

Abstract:
A light emitting device of the invention includes a substrate; a light emitting element mounted on the upper surface of the substrate; a wire that is electrically connected to the light emitting element; and a plate-shaped light-transmissive member that covers the light emitting element. The wire has a stack structure in which a first bonding ball, a bonding wire, and a second bonding ball are stacked in that order, the stack structure is disposed on the upper surface of the light emitting element, and the plate-shaped light-transmissive member is disposed above the stack structure.
Public/Granted literature
- US20150091027A1 LIGHT EMITTING DEVICE Public/Granted day:2015-04-02
Information query
IPC分类: