Invention Grant
- Patent Title: Dielectric coupling systems for EHF communications
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Application No.: US15360973Application Date: 2016-11-23
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Publication No.: US10069183B2Publication Date: 2018-09-04
- Inventor: Gary D. McCormack , Yanghyo Kim , Emilio Sovero
- Applicant: Keyssa, Inc.
- Applicant Address: US CA Campbell
- Assignee: Keyssa, Inc.
- Current Assignee: Keyssa, Inc.
- Current Assignee Address: US CA Campbell
- Agency: Fenwick & West LLP
- Main IPC: H01Q1/12
- IPC: H01Q1/12 ; H01Q1/50 ; H01P3/16 ; H01P3/12

Abstract:
Dielectric coupler devices and dielectric coupling systems for communicating EHF electromagnetic signals, and their methods of use. The coupler devices include an electrically conductive body having a major surface, the electrically conductive body defining an elongate recess, and the elongate recess having a floor, where a dielectric body is disposed in the elongate recess and configured to conduct an EHF electromagnetic signal.
Public/Granted literature
- US20170077582A1 DIELECTRIC COUPLING SYSTEMS FOR EHF COMMUNICATIONS Public/Granted day:2017-03-16
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