Invention Grant
- Patent Title: Assembly apparatus
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Application No.: US15547245Application Date: 2016-01-27
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Publication No.: US10069268B2Publication Date: 2018-09-04
- Inventor: Sin Wei Woon , Wen Kai Lin
- Applicant: ZionTECH Pte Ltd
- Applicant Address: SG Singapore
- Assignee: ZionTECH Pte Ltd
- Current Assignee: ZionTECH Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Dinsmore & Shohl LLP
- Priority: SG10201500850S 20150204
- International Application: PCT/SG2016/050036 WO 20160127
- International Announcement: WO2016/126203 WO 20160811
- Main IPC: B23P19/04
- IPC: B23P19/04 ; H01R43/20

Abstract:
An assembly apparatus (10) is provided. The assembly apparatus (10) includes a first feeding mechanism (12) arranged in use to feed a series of first components (14), a holding mechanism (16) arranged in use to hold consecutive ones of the first components (14) in place, a cutter (18) arranged in use to separate individual ones of the first components (14) while being held in place by the holding mechanism (16), an inserter (20) arranged in use to push a separated first component (14) into a corresponding opening in a second component (22), and a drive mechanism (24) coupled to each of the first feeding mechanism (12), the holding mechanism (16), the cutter (18) and the inserter (20). The drive mechanism (24) is arranged in use to synchronize movement of the first feeding mechanism (12), the holding mechanism (16), the cutter (18) and the inserter (20).
Public/Granted literature
- US20180013254A1 ASSEMBLY APPARATUS Public/Granted day:2018-01-11
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