Invention Grant
- Patent Title: Heat dissipation device and electronic system
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Application No.: US15411858Application Date: 2017-01-20
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Publication No.: US10069442B2Publication Date: 2018-09-04
- Inventor: Te-Hsuan Chin , Shui-Fa Tsai
- Applicant: COOLER MASTER CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: COOLER MASTER CO., LTD.
- Current Assignee: COOLER MASTER CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H02N11/00
- IPC: H02N11/00 ; H02K7/18 ; H05K7/20 ; H01L23/427 ; F03G7/06 ; H02K9/20

Abstract:
A heat dissipation device applied to a heat source includes a heat conduction unit and a power generation unit. A fluid chamber and a rotor chamber are configured inside the heat conduction unit. The fluid chamber and the rotor chamber are communicated with each other. A working fluid is configured in the fluid chamber. The power generation unit has a rotor and a power generation module. The rotor is connected to the power generation module and is configured in the rotor chamber. The rotor is driven by the working fluid so as to enable the power generation unit to output electrical energy. An electronic system with the heat dissipation device is also disclosed.
Public/Granted literature
- US20170222575A1 HEAT DISSIPATION DEVICE AND ELECTRONIC SYSTEM Public/Granted day:2017-08-03
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