Invention Grant
- Patent Title: Surface acoustic wave device and filter
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Application No.: US15165175Application Date: 2016-05-26
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Publication No.: US10069477B2Publication Date: 2018-09-04
- Inventor: Hidetaro Nakazawa , Takashi Matsuda
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2015-123933 20150619
- Main IPC: H03H9/64
- IPC: H03H9/64 ; H03H9/02

Abstract:
A surface acoustic wave device includes: comb-shaped electrodes each including electrode fingers and dummy electrode fingers; and additional films located to cover gaps between tips of the electrode fingers of one of the comb-shaped electrodes and tips of the dummy electrode fingers of the other, wherein each of the additional films overlap with at least one of the electrode fingers and the dummy electrode fingers located lateral to the corresponding gap in a first direction in which the electrode fingers extend or in a second direction intersecting with the first direction, and a distance G of the gap is 0
Public/Granted literature
- US20160373084A1 SURFACE ACOUSTIC WAVE DEVICE AND FILTER Public/Granted day:2016-12-22
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