The present invention provides a diaphragm structure of a sounding apparatus comprising: a thin-film layer; a first circuit thin-film layer fixed on a first side of the thin-film layer by means of a first electrolytic bonding layer; a second circuit thin-film layer fixed on a second side of the thin-film layer by means of a second electrolytic bonding layer; multiple holes passing through the first circuit thin-film layer, the thin-film layer and the second circuit thin-film layer; and multiple conductive layers disposed on inner circumferential walls of the holes and in contact with the first circuit thin-film layer and the second circuit thin-film layer. In the diaphragm structure provided by the present invention, instead of using back adhesives, electrolytic bonding is used to fix the circuit thin-film layers on two sides of a thin-film layer, thereby greatly reducing the thickness of the diaphragm structure.