Invention Grant
- Patent Title: High-frequency module and communication apparatus
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Application No.: US15699202Application Date: 2017-09-08
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Publication No.: US10070513B2Publication Date: 2018-09-04
- Inventor: Yoichi Sawada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2016-176668 20160909
- Main IPC: H04B1/44
- IPC: H04B1/44 ; H05K1/02 ; H03F1/26 ; H03F3/195 ; H03F3/213 ; H04B1/46 ; H04B1/40 ; H05K1/16 ; H05K1/18

Abstract:
A high-frequency module includes: a power receiving terminal; an LNA, a reception switch that switches among a plurality of signals in different bands and outputs the signals to the LNA; a first conduction path spanning from the power receiving terminal to a power source terminal of the reception switch; a second conduction path spanning from a branching point in the first conduction path to a power source terminal of the LNA; a third conduction path branching from at least one of the first conduction path and the second conduction path and spanning to a ground; and a capacitor inserted into the third conduction path. A second inductance of the second conduction path is greater than a first inductance of a part spanning from the branching point in the first conduction path to the power source terminal.
Public/Granted literature
- US20180077790A1 HIGH-FREQUENCY MODULE AND COMMUNICATION APPARATUS Public/Granted day:2018-03-15
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