Invention Grant
- Patent Title: Resin composition for packaging and printed circuit board using the same
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Application No.: US15136231Application Date: 2016-04-22
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Publication No.: US10070519B2Publication Date: 2018-09-04
- Inventor: Sung Chul Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0076659 20150529
- Main IPC: H05K1/03
- IPC: H05K1/03 ; C08K7/00 ; C08K3/36 ; C08K3/40 ; C08K3/26 ; C08K3/013
Abstract:
A resin composition for packaging, an insulating film and a printed circuit board manufactured with the resin composition, and a method of manufacturing a printed circuit board with the resin composition are provided. The resin composition for packaging includes an epoxy resin, and inorganic filler particles dispersed in the epoxy resin, and an aspect ratio of the inorganic filler particles is 1.0 or more and 3.0 or less.
Public/Granted literature
- US20160353570A1 RESIN COMPOSITION FOR PACKAGING AND PRINTED CIRCUIT BOARD USING THE SAME Public/Granted day:2016-12-01
Information query
