Methods/structures of forming package structures are described. Those methods/structures may include forming a first sub-laminated board comprising a first horseshoe structure that is disposed on a top surface of a first outer ground structure, forming a second sub-laminated board comprising a second horseshoe structure disposed on a second outer ground structure, wherein the second sub-laminated board comprises a stripline trace on a top surface of the second sub-laminated board, and laminating the first sub-laminated board to the second sub-laminated board, wherein the first and second horseshoe structures are in contact with each other during the lamination process.