Invention Grant
- Patent Title: Connector with structures for bi-lateral decoupling of a hardware interface
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Application No.: US15201312Application Date: 2016-07-01
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Publication No.: US10070526B2Publication Date: 2018-09-04
- Inventor: Charles C. Phares , Kevin J. Ceurter
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01R12/70 ; H05K5/00 ; H05K5/02 ; H01R12/73

Abstract:
Techniques and mechanisms to provide a connector for securing to a first printed circuit board (PCB). In an embodiment, the connector is configured to receive a second PCB, where a first hardware interface of the connector includes conductors to facilitate bilateral decoupling from (and coupling to) respective hardware interfaces of the first PCB and the second PCB. A first conductor of the first hardware interface includes a first portion configured to move, relative to a housing structure of the connector, in response to the connector receiving a portion of a device which comprises the second PCB. A second portion of the first conductor is configured to be brought into contact with a conductive pad of the device. In another embodiment, the connector includes housing structures configured to move relative to one another while the connector is secured to the first PCB.
Public/Granted literature
- US20180007788A1 CONNECTOR WITH STRUCTURES FOR BI-LATERAL DECOUPLING OF A HARDWARE INTERFACE Public/Granted day:2018-01-04
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