A method of using a putty in a mechanical processing method includes dosing a binder component comprising at least one epoxy resin, dosing a hardener component comprising at least one NH-group-containing compound, mixing the binder component and the hardener component into a putty mass, and applying the putty mass on an undercoat. At least one of the binder component and the hardener component comprises synthetic hollow bodies so that the putty mass comprises 0.1 to 15 wt.-% of the synthetic hollow bodies relative to a total weight of the putty mass.