A heat dissipation device includes a first and a second housing, at least one pipe, and a working fluid. The first and the second housing internally respectively defines a first and a second chamber, in which a first and a second wick structure is respectively formed, and has at least one first and second opening communicated with the first and the second chamber respectively. The pipe has a pipe body, and a first and second extended portion, which respectively has a first and a second open end, and a first and a second through opening, and is inserted into and connected to the first and the second chamber via the first and the second opening respectively. The pipe internally defines a pipe chamber, in which a pipe wick structure is formed. The working fluid is provided in the first and the second, and the pipe chamber.