- Patent Title: Multilayer electronic component and manufacturing method therefor
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Application No.: US15337261Application Date: 2016-10-28
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Publication No.: US10079103B2Publication Date: 2018-09-18
- Inventor: Tetsuo Kawakami , Takahiro Hirao , Tsutomu Tanaka , Tomohiro Kageyama
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2015-214568 20151030
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G4/236 ; H01G4/232

Abstract:
A multilayer electronic component includes outer electrodes each including an outer electrode main body electrically conducted to an internal electrode and entering portions that project from the outer electrode main body as a base end and enter into the electronic component element through an end surface of the electronic component element. The entering portions each include a slope relative to a principal surface in a flat region including a major portion of the internal electrode.
Public/Granted literature
- US20170125167A1 MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR Public/Granted day:2017-05-04
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