Invention Grant
- Patent Title: Multilayer capacitor and mounting structure
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Application No.: US15533421Application Date: 2015-12-11
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Publication No.: US10079108B2Publication Date: 2018-09-18
- Inventor: Hidefumi Hatanaka , Katsuichi Kato
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2014-257512 20141219
- International Application: PCT/JP2015/084801 WO 20151211
- International Announcement: WO2016/098702 WO 20160623
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/35 ; H01G2/06 ; H01G4/232 ; H01G4/008 ; H01G4/12

Abstract:
A multilayer capacitor includes a pair of external electrodes each having an end face portion; a first principal face extending portion; a second principal face extending portion; a first side face extending portion; and a second side face extending portion. The pair of external electrodes each includes a base electrode and a metallic layer. The metallic layer includes a first metallic layer and a second metallic layer located outside the first metallic layer. An intermetallic compound layer is located outside the first metallic layer, and is exposed from the second metallic layer in a ridge portion lying between the end face portion and the first principal face extending portion, a ridge portion lying between the first side face extending portion and the first principal face extending portion, and a ridge portion lying between the second side face extending portion and the first principal face extending portion.
Public/Granted literature
- US20170330689A1 MULTILAYER CAPACITOR AND MOUNTING STRUCTURE Public/Granted day:2017-11-16
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