Invention Grant
- Patent Title: Thin film capacitor
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Application No.: US15432189Application Date: 2017-02-14
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Publication No.: US10079109B2Publication Date: 2018-09-18
- Inventor: Su Bong Jang , Sang Jong Lee , Hee Soo Yoon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0096237 20160728
- Main IPC: H01G4/33
- IPC: H01G4/33 ; H01G4/012 ; H01G4/018

Abstract:
A thin film capacitor includes: a body in which first and second internal electrodes and dielectric layers are alternately stacked; and a plurality of first vias disposed in the body and electrically connected to the first internal electrodes and a plurality of second vias disposed in the body and electrically connected to the second internal electrodes. Each of the first and second vias includes two regions on left and right sides of a central portion, the two regions being alternately disposed in a stacking direction.
Public/Granted literature
- US20180033559A1 THIN FILM CAPACITOR Public/Granted day:2018-02-01
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