Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US14977977Application Date: 2015-12-22
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Publication No.: US10079157B2Publication Date: 2018-09-18
- Inventor: Jong Sik Paek , Doo Hyun Park , Seong Min Seo , Sung Geun Kang , Yong Song , Wang Gu Lee , Eun Young Lee , Seo Yeon Ahn , Pil Je Sung
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2014-0193744 20141230
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/14 ; H01L23/498 ; H01L21/60 ; H01L23/31 ; H01L23/00 ; H01L23/15
Abstract:
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.
Public/Granted literature
- US20160189980A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-06-30
Information query
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