Invention Grant
- Patent Title: Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
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Application No.: US15192310Application Date: 2016-06-24
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Publication No.: US10079159B2Publication Date: 2018-09-18
- Inventor: Jing-Cheng Lin , Jui-Pin Hung , Li-Hui Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/552 ; H01L21/48 ; H01L23/00 ; H01L23/498 ; H01L23/538 ; H01L21/683 ; H01L25/10 ; H01L21/56 ; H01L23/528
Abstract:
Various embodiments of mechanisms for forming through package vias (TPVs) with openings surrounding end-portions of the TPVs and a package on package (PoP) device with bonding structures utilizing the TPVs are provided. The openings are formed by removing materials, such as by laser drill, surrounding the end-portions of the TPVs. The openings surrounding the end-portions of the TPVs of the die package enable solders of the bonding structures formed between another die package to remain in the openings without sliding and consequently increases yield and reliability of the bonding structures. Polymers may also be added to fill the openings surrounding the TPVs or even the space between the die packages to reduce cracking of the bonding structures under stress.
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Information query
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