Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US15273933Application Date: 2016-09-23
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Publication No.: US10079186B2Publication Date: 2018-09-18
- Inventor: Sangyub Ie , Minwoo Song , Jonghan Lee , Hyungsuk Jung , Hyeri Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0134763 20150923; KR10-2016-0104477 20160817
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/66 ; H01L27/088 ; H01L29/49 ; H01L21/8234 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/08

Abstract:
A method of fabricating a semiconductor device includes forming first and second fin patterns in an active region and in a measurement region of a substrate, respectively, the measurement region being different from the active region, forming first and second gate electrodes to cross the first and second fin patterns, respectively, and measuring a contact potential difference (Vcpd) of the second gate electrode to determine a threshold voltage of the first gate electrode based on the measured contact potential difference (Vcpd).
Public/Granted literature
- US20170084507A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2017-03-23
Information query
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