In order to restrict cracking or the like in a connection member such as solder, provided is a semiconductor device including a first component; a second component that is arranged on a front surface of the first component; and a connection portion that is provided between the first component and the second component and connects the second component to the first component. A first groove and a second groove having different shapes are formed in the front surface of the first component at positions opposite a first corner and a second corner of the second component, and the connection portion is also formed within the first groove and the second groove.