Invention Grant
- Patent Title: Substrate assembly and manufacturing method thereof and display device
-
Application No.: US15107876Application Date: 2016-01-13
-
Publication No.: US10079272B2Publication Date: 2018-09-18
- Inventor: Yingying Song , Li Sun
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Womble Bond Dickinson (US) LLP
- Priority: CN201510461859 20150731
- International Application: PCT/CN2016/070776 WO 20160113
- International Announcement: WO2017/020556 WO 20170209
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L21/00 ; H01L27/32 ; H01L25/065 ; H01L29/786 ; H01L51/00 ; H01L51/50 ; H01L51/56
Abstract:
The present invention provides a substrate assembly comprising: a substrate; electrodes, metal wirings and TFTs formed on the substrate; and banks formed over the substrate, the banks enclosing pixel areas and exposing the electrodes; wherein a surface of the bank away from the substrate comprises one or more grooves, the grooves being adapted for collecting ink droplets remaining on the bank during subsequent inkjet printing process. The present invention further relates to a method for manufacturing a substrate assembly and a display device.
Public/Granted literature
- US20170213878A1 Substrate assembly and Manufacturing method thereof and Display device Public/Granted day:2017-07-27
Information query
IPC分类:
