Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US14473158Application Date: 2014-08-29
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Publication No.: US10079282B2Publication Date: 2018-09-18
- Inventor: Mariko Suzuki , Tadashi Sakai , Chiharu Ota , Kazuto Takao , Takashi Shinohe
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-182560 20130903
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/00 ; H01L29/16 ; H01L29/868 ; H01L21/02 ; H01L21/04 ; H01L29/66 ; H01L29/732 ; H01L29/861 ; H01L29/04 ; H01L29/06

Abstract:
A semiconductor device according to an embodiment includes an i-type or a p-type first diamond semiconductor layer, an n-type second diamond semiconductor layer provided on the first diamond semiconductor layer, a mesa structure and an n-type first diamond semiconductor region provided on the side surface. The mesa structure includes the first diamond semiconductor layer, the second diamond semiconductor layer, a top surface with a plane orientation of ±10 degrees or less from a {100} plane, and a side surface inclined by 20 to 90 degrees with respect to a direction of ±20 degrees from the {100} plane. The first diamond semiconductor region is in contact with the second diamond semiconductor layer and has an n-type impurity concentration lower than an n-type impurity concentration of the second diamond semiconductor layer.
Public/Granted literature
- US20150060885A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-03-05
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