Invention Grant
- Patent Title: Compound semiconductor device
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Application No.: US15452999Application Date: 2017-03-08
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Publication No.: US10079297B2Publication Date: 2018-09-18
- Inventor: Akira Endoh
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2016-050147 20160314
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/165 ; H01L29/205 ; H01L29/423 ; H01L29/66 ; H01L29/778

Abstract:
A compound semiconductor device includes a compound semiconductor layer, a gate electrode disposed above the compound semiconductor layer, and source and drain electrodes disposed above the compound semiconductor layer with the gate electrode between the source and drain electrodes, wherein the compound semiconductor layer has a groove in a surface thereof at least between the source electrode and the gate electrode in a region between the source electrode and the drain electrode, the groove gradually deepened toward the source electrode.
Public/Granted literature
- US20170263742A1 COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2017-09-14
Information query
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