Invention Grant
- Patent Title: Semiconductor light-receiving device
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Application No.: US15054841Application Date: 2016-02-26
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Publication No.: US10079324B2Publication Date: 2018-09-18
- Inventor: Harunaka Yamaguchi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2015-150723 20150730
- Main IPC: H01L31/107
- IPC: H01L31/107 ; H01L31/0304 ; H01L31/0352

Abstract:
A semiconductor light-receiving device includes: a semi-insulating substrate; and a buffer layer, a p-type contact layer, a light absorption layer, a p-type field alleviating layer, an avalanche multiplication layer, an n-type field alleviating layer and an n-type contact layer laminated in order on the semi-insulating substrate, wherein the buffer layer includes a superlattice obtained by alternately laminating an InP layer and an AlxGayIn1-x-yAs layer (0.16≤x≤0.48, 0≤y≤0.31) and does not absorb light of a wavelength band absorbed by the light absorption layer.
Public/Granted literature
- US20170033254A1 SEMICONDUCTOR LIGHT-RECEIVING DEVICE Public/Granted day:2017-02-02
Information query
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