An integrated circuit package includes an electromagnetic communication link formed by a portion of a lead frame within an encapsulation. The lead frame includes a first conductor forming a first conductive loop a second conductor forming a second conductive loop galvanically isolated from the first conductive loop. The second conductive loop is magnetically coupled to the first conductive loop to provide a magnetic communication link between the first and second conductors. A first transceiver circuit includes a transmit circuit coupled to the first conductive loop. A second transceiver circuit includes a receive circuit coupled to the second conductive loop. A signal transmitted from the transmit circuit included in first transceiver circuit and coupled to the first conductor is coupled to be magnetically communicated through the magnetic communication link to the receive circuit included in second transceiver circuit and coupled to the second conductor.