Invention Grant
- Patent Title: Fan-out POP structure with inconsecutive polymer layer
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Application No.: US15284003Application Date: 2016-10-03
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Publication No.: US10083913B2Publication Date: 2018-09-25
- Inventor: Yi-Lin Tsai , Jeffrey Chang , Jing-Cheng Lin , Nai-Wei Liu , Tsei-Chung Fu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/31 ; H01L25/00 ; H01L25/10 ; H01L21/56 ; H01L21/48 ; H01L21/78 ; H01L25/065 ; H01L21/683 ; H01L23/00 ; H01L23/498
Abstract:
A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.
Public/Granted literature
- US20170025359A1 Fan-out POP Structure with Inconsecutive Polymer Layer Public/Granted day:2017-01-26
Information query
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