Invention Grant
- Patent Title: NVM device in SOI technology and method of fabricating an according device
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Application No.: US15237794Application Date: 2016-08-16
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Publication No.: US10084057B2Publication Date: 2018-09-25
- Inventor: Sven Beyer , Martin Trentzsch , Stefan Flachowsky , Axel Henke
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H03K3/01
- IPC: H03K3/01 ; H01L29/51 ; H01L21/02 ; H01L21/84 ; H01L27/12 ; H01L29/06

Abstract:
The present disclosure provides in one aspect a semiconductor device including a substrate structure comprising an active semiconductor material formed over a base substrate and a buried insulating material formed between the active semiconductor material and the base substrate, a ferroelectric gate structure disposed over the active semiconductor material in an active region of the substrate structure, the ferroelectric gate structure comprising a gate electrode and a ferroelectric material layer, and a contact region formed in the base substrate under the ferroelectric gate structure.
Public/Granted literature
- US20180053832A1 NVM DEVICE IN SOI TECHNOLOGY AND METHOD OF FABRICATING AN ACCORDING DEVICE Public/Granted day:2018-02-22
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