Invention Grant
- Patent Title: Waterproof terminal structure and electronic device module
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Application No.: US15801895Application Date: 2017-11-02
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Publication No.: US10084276B2Publication Date: 2018-09-25
- Inventor: Seiya Matsuo , Akihiro Matsunaga
- Applicant: Japan Aviation Electronics Industry, Limited
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JP2017-014400 20170130
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R12/57 ; H01R33/965 ; H01R13/52 ; H01R13/11

Abstract:
A waterproof terminal structure includes a contact having a spring contact point, and a terminal member that holds the contact, the terminal member including a contact connection portion having conductivity and connected to the contact, a seal portion tightly attached to an insulating waterproof member disposed at least along a circumference of an opening of a housing, and a substrate mount portion having conductivity and connected to a wiring portion of a substrate, the contact connection portion and the substrate mount portion being electrically connected to each other and positioned such that a water entering path from the contact connection portion toward the substrate mount portion is cut by the seal portion, the contact not penetrating the terminal member.
Public/Granted literature
- US20180219342A1 WATERPROOF TERMINAL STRUCTURE AND ELECTRONIC DEVICE MODULE Public/Granted day:2018-08-02
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