Invention Grant
- Patent Title: Earphone assemblies with multiple subassembly housings
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Application No.: US15696525Application Date: 2017-09-06
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Publication No.: US10085080B2Publication Date: 2018-09-25
- Inventor: John Bruss , Robert A. Boyd , Carlos M. Santana , Vijay Koneru
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Van Court & Aldridge LLP
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H01R12/57 ; H01R12/53 ; H01R43/20 ; H05K5/00 ; H01H13/50
Abstract:
Earphone assemblies with multiple subassembly housings are provided.
Public/Granted literature
- US20180070164A1 EARPHONE ASSEMBLIES WITH MULTIPLE SUBASSEMBLY HOUSINGS Public/Granted day:2018-03-08
Information query
