Invention Grant
- Patent Title: Resonance damping for audio transducer systems
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Application No.: US15622251Application Date: 2017-06-14
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Publication No.: US10085086B2Publication Date: 2018-09-25
- Inventor: Shengrong Shi
- Applicant: Nokia Technologies Oy
- Applicant Address: FI Espoo
- Assignee: Nokia Technologies Oy
- Current Assignee: Nokia Technologies Oy
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R1/20 ; H04R1/28

Abstract:
An apparatus comprising: an audio transducer configured to at least one of: generate sound upon receiving an audio signal provided by the apparatus; and convert sound into an audio signal to be processed by the apparatus; a housing component comprising one or more sound apertures configured to allow the transmission of sound through the one or more sound apertures; and an acoustic cavity inside the apparatus being acoustically coupled to the audio transducer using the one or more sound apertures wherein the one or more sound apertures are configured to provide an acoustic damping.
Public/Granted literature
- US20170289674A1 Resonance Damping for Audio Transducer Systems Public/Granted day:2017-10-05
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