- Patent Title: Flat circuit body with terminal and manufacturing method thereof
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Application No.: US14327235Application Date: 2014-07-09
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Publication No.: US10085340B2Publication Date: 2018-09-25
- Inventor: Naoki Ito
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2012-008071 20120118
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/11 ; H01R4/18 ; H01R12/69 ; H01R43/048

Abstract:
A portion of a flat conductor is exposed from an insulating layer covering at least one of surfaces of the flat conductor. A terminal includes a bottom plate on which the exposed portion of the flat conductor is provided, and crimp claws which are raised at two side edges of the bottom plate so that the exposed portion is disposed therebetween. The exposed portion is folded so as to define a bottom layer which faces the bottom plate and a top layer which faces opposite to the bottom plate. The top layer is configured to be plastically deformed so as to fill a gap between the top layer and inner surfaces of the crimp claws when the crimp claws are crimped onto the top layer, so that the bottom layer is in surface contact with the bottom plate.
Public/Granted literature
- US20140318849A1 FLAT CIRCUIT BODY WITH TERMINAL AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-10-30
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