Invention Grant
- Patent Title: Flexible printed circuit (FPC) board
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Application No.: US15840054Application Date: 2017-12-13
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Publication No.: US10085354B2Publication Date: 2018-09-25
- Inventor: Shinya Iizaka
- Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Applicant Address: JP Yokohama-shi
- Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Current Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Current Assignee Address: JP Yokohama-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Laura G. Remus
- Priority: JP2014-175503 20140829; JP2014-175532 20140829
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/36 ; H05K1/14 ; H05K1/11 ; H05K1/02

Abstract:
A flexible printed circuit (FPC) board having reinforcing pattern against bending is disclosed. The FPC board provides an RF interconnection extending from an RF electrode. Two ground electrodes are formed in respective sides of the RF electrode. The ground electrodes extend respective extended portions along the RF interconnection to protect the RF interconnection from breakage due to bending of the FPC board. The extended portion provides an end portion bent toward the RF interconnection to compensate for impedance mismatching of the RF interconnection.
Public/Granted literature
- US20180103549A1 FLEXIBLE PRINTED CIRCUIT (FPC) BOARD Public/Granted day:2018-04-12
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