A thermal management system that provides cooling to an electronic device is disclosed. The thermal management system includes a surface having a plurality of extended elements thermally coupled to the surface, a plurality of vibrator assemblies configured to generate a cooling flow across the surface, and a mounting structure disposed atop the plurality of extended elements of the surface to position the plurality of vibrator assemblies relative to the surface. The mounting structure is configured to orient each of the plurality of vibrator assemblies to the surface at an angel, such that the cooling flow generated by the plurality of vibrator assemblies impinges on the extended elements at an angle.