In a laser processing method for carrying out hole-forming on a plate-shaped workpiece, [A] a hole is formed by laser-cutting the workpiece along an outline of the hole to be formed, [B] a laser processing head is moved with respect to the workpiece after forming the hole, and [C] a cutout piece inside the outline of the hole is dropped off by moving the laser processing head while jetting assist gas from the laser processing head to the cutout piece inside the outline. According to the laser processing method, the cutout piece generated when carrying out hole-forming by laser processing can be prevented from getting stuck in a hole.