Invention Grant
- Patent Title: Resin member and method for bonding resin members
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Application No.: US15007075Application Date: 2016-01-26
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Publication No.: US10086562B2Publication Date: 2018-10-02
- Inventor: Tsubasa Ono
- Applicant: FUJI JUKOGYO KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: SUBARU CORPORATION
- Current Assignee: SUBARU CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2015-013989 20150128
- Main IPC: B29C65/08
- IPC: B29C65/08 ; B29C65/00 ; B32B7/04 ; B32B3/26 ; B32B3/28 ; B32B3/30 ; B32B5/22 ; B32B5/26 ; B32B27/18 ; B32B27/08
Abstract:
A resin member contains a thermoplastic resin and is bonded to another resin member by ultrasonic welding. The resin member includes: a melting start portion to which contact pressure is applied during the ultrasonic welding; a groove unit that is formed around a periphery of the melting start portion; and at least one wall that is formed so as to cross a direction from the melting start portion toward an outside and partitions the groove unit.
Public/Granted literature
- US20160214347A1 RESIN MEMBER AND METHOD FOR BONDING RESIN MEMBERS Public/Granted day:2016-07-28
Information query
