Invention Grant
- Patent Title: Stack, method for treating substrate material, temporary fixing composition, and semiconductor device
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Application No.: US15038738Application Date: 2014-10-30
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Publication No.: US10086583B2Publication Date: 2018-10-02
- Inventor: Torahiko Yamaguchi , Hiroyuki Ishii , Katsumi Inomata
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP2013-243800 20131126
- International Application: PCT/JP2014/078908 WO 20141030
- International Announcement: WO2015/079863 WO 20150604
- Main IPC: B32B7/06
- IPC: B32B7/06 ; B32B7/12 ; B32B27/08 ; B32B27/18 ; B32B27/30 ; B32B27/36 ; B32B37/26 ; B32B38/10 ; B32B43/00 ; C09J165/00 ; H01L21/683 ; B32B37/12

Abstract:
There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.
Public/Granted literature
- US20160375652A1 STACK, METHOD FOR TREATING SUBSTRATE MATERIAL, TEMPORARY FIXING COMPOSITION, AND SEMICONDUCTOR DEVICE Public/Granted day:2016-12-29
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