Invention Grant
- Patent Title: Package
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Application No.: US14969386Application Date: 2015-12-15
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Publication No.: US10086970B2Publication Date: 2018-10-02
- Inventor: Brady Gutekunst , Donald H Ankney , Joseph J Bruchman , Jerry Gordon
- Applicant: Berry Plastics Corporation
- Applicant Address: US IN Evansville
- Assignee: Berry Plastics Corporation
- Current Assignee: Berry Plastics Corporation
- Current Assignee Address: US IN Evansville
- Agency: Barnes & Thornburg LLP
- Main IPC: B65D90/02
- IPC: B65D90/02 ; B65D1/02 ; B65D79/00
Abstract:
The present disclosure relates to a package including a floor and a side wall extending upwardly from the floor. The package is configured to receive a high-temperature fluid during a container-filling activity at a container-filling factory.
Public/Granted literature
- US20160167823A1 PACKAGE Public/Granted day:2016-06-16
Information query
