Invention Grant
- Patent Title: Oxide sintered body and semiconductor device
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Application No.: US15100174Application Date: 2015-04-08
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Publication No.: US10087517B2Publication Date: 2018-10-02
- Inventor: Miki Miyanaga , Kenichi Watatani , Koichi Sogabe , Hideaki Awata , Kenichi Kurisu
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Kerri M. Patterson
- Priority: JP2014-215468 20141022
- International Application: PCT/JP2015/060969 WO 20150408
- International Announcement: WO2016/063557 WO 20160428
- Main IPC: H01B1/08
- IPC: H01B1/08 ; C23C14/00 ; C23C14/34 ; C04B35/495 ; C04B35/622 ; C23C14/08 ; H01J37/34 ; H01L21/02 ; H01L29/66 ; H01L29/786 ; C04B35/00

Abstract:
There is provided an oxide sintered body including indium, tungsten, and at least one of zinc and tin, wherein the oxide sintered body includes, as a crystal phase, a complex oxide crystal phase including tungsten and at least one of zinc and tin. There is also provided a semiconductor device including an oxide semiconductor film formed by a sputtering method by using the oxide sintered body as a target.
Public/Granted literature
- US20170029933A1 OXIDE SINTERED BODY AND SEMICONDUCTOR DEVICE Public/Granted day:2017-02-02
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