Invention Grant
- Patent Title: Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wire
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Application No.: US14432827Application Date: 2013-08-23
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Publication No.: US10087552B2Publication Date: 2018-10-02
- Inventor: Takashi Koshiro , Hironao Okayama , Teppei Kurokawa , Kouji Nanbu
- Applicant: Toyo Kohan Co., Ltd. , Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Tokyo JP Osaka
- Assignee: Toyo Kohan Co., Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: Toyo Kohan Co., Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Tokyo JP Osaka
- Agency: McCarter & English, LLP
- Priority: JP2012-223187 20121005
- International Application: PCT/JP2013/072520 WO 20130823
- International Announcement: WO2014/054351 WO 20140410
- Main IPC: C22F1/08
- IPC: C22F1/08 ; C30B29/22 ; H01L39/24 ; C30B29/52 ; C30B33/02 ; C22C9/00 ; C22C9/02 ; C22C9/04 ; C30B1/04 ; C30B23/02 ; C30B25/18 ; H01B12/06 ; H01B13/00 ; H01L39/12

Abstract:
An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum Δϕ of a peak based on the pole figure of the copper layer is within 5° and the tail width Δβ of the peak based on the pole figure is within 15° Such a substrate for epitaxial growth is manufactured by a 1st step of performing heat treatment of a copper layer so that Δϕ is within 6° and the tail width Δβ is within 25°, and after the 1st step, a 2nd step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1st step, so that Δϕ is within 5° and the tail width Δβ is within 15°.
Public/Granted literature
- US20150299899A1 SUBSTRATE FOR EPITAXIAL GROWTH, MANUFACTURING METHOD THEREFOR, AND SUBSTRATE FOR SUPERCONDUCTING WIRE Public/Granted day:2015-10-22
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